Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal

一种取代锡铅钎料的Sn-In-Ag无铅钎料

Abstract

焊点低,焊接工艺性能力学性能好的一种Sn-In-Ag无铅软钎料以所述钎料总重量为基准由以下组分构成:In 8~35%,Ag 0.1~5%,Bi 0.01~3%,Sb 0.01~3%,Cu 0~1%,Ni 0.01~0.2%,P 0.0005-0.1%,X 0.0005-0.1%,Sn 余量,X 为Ga、Ge、混合稀土中的一种或任意几种的组合。本发明适合做钎料。
Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal is low in welding point and good in welding technology performance and mechanical performance. The unleaded Sn-In-Ag brazing filler metal replacing the tin-lead brazing filler metal is composed of 8%-35% of In, 0.1%-5% of Ag, 0.01%-3% of Bi, 0.01%-3% of Sb, 0-1% of Cu, 0.01%-0.2% of Ni, 0.0005%-0.1% of P, 0.0005%-0.1% of X and the balance of Sn with the total weight of brazing filler metal as a benchmark, wherein the X is one or any mixture of Ga, Ge and mixed rare earth. The unleaded Sn-In-Ag brazing filler metal replacing the tin-lead brazing filler metal is suitable for being used as the brazing filler metal.

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    EP-2979807-A4December 07, 2016Harima Chemicals IncLötlegierung, lötzusammensetzung, lötpaste und elektronische leiterplatte